Organization / Terms / mold compound supplier

Other mold compound supplier products in development included improved molding compound adhesion to palladium plated leadframes, high-thermal-conductivity molding compounds for power devices, and others that need lower thermal resistances. Ideally, these mold compound supplier materials could be developed to replace ceramic packages. YTC is also working on recyclable molding compounds (presumably thermoplastics) and low-viscosity compounds intended to go under flip chips (a process developed by IBM). YTC mold compound supplier is also developing mold compound pellets that are dust-free for use in the future (class 100) clean-room assembly and packaging areas. YTC is also studying trapping agents that can slow the migration of bromine ions (fire retardants) in molding compounds and thus increase gold wire bond reliability. It is developing compounds that are stronger, have greater leadframe adhesion, and have lower moisture absorption, for use in TSOPs (thin small-outlined packages).

In addition, mold compound supplier is developing materials that require no post mold cure (currently such cure takes five to six hours at 175 degrees C). It is using the mold compound supplier software for modeling its thermosetting plastics. Also being developed are lines of adhesive contacts and adhesive tapes for die attach, new assembly, flexible mounting for chip carriers, etc. It seems to have a well thought out strategy for applying its specific technologies to the entire range of assembly and packaging needs of the industry.